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  050-4926 rev a 12-2004 d1 s1d2 g1 g2 s2 d3 g3 s3d4 g4 s4 maximum ratings all ratings per die: t c = 25c unless otherwise specified. static electrical characteristics symbol bv dss v ds (on) i dss i gss g fs v isolation v gs (th) characteristic / test conditions drain-source breakdown voltage (v gs = 0v, i d = 250 a) on state drain voltage 1 (i d (on) = 4.5a, v gs = 10v) zero gate voltage drain current (v ds = 1000v, v gs = 0v) zero gate voltage drain current (v ds = 800v, v gs = 0v, t c = 125c) gate-source leakage current (v gs = 30v, v ds = 0v) forward transconductance (v ds = 25v, i d = 4.5a) rms voltage (60hz sinewave from terminals to mounting surface for 1 minute) gate threshold voltage (v ds = v gs , i d = 50ma) min typ max 1000 6.8 7.5 25 250 100 34 2500 35 unit volts a na mhos volts symbol v dss i d v gs p d t j ,t stg t l parameter drain-source voltage continuous drain current @ t c = 25c gate-source voltage total device dissipation @ t c = 25c operating and storage junction temperature range lead temperature: 0.063" from case for 10 sec. arf 1510 1000 9 30 1500 -55 to 200 300 unit volts amps volts watts c rf power mosfet full-bridge 400v 750w 40mhz the ARF1510 is four rf power transistor arranged in an h-bridge configuration. it is intended for off-line 300v operation in high power scientific, medical and, industrial rf power generator and amplifier applications up to 40 mhz. ? specified 300 volt, 27.12 mhz characteristics: ? output power = 750 watts. ? gain = 17db (class d) ? efficiency > 80% ? high performance power rf package. ? very high breakdown for improved ruggedness. ? low thermal resistance. ? nitride passivated die for improved reliability. ARF1510 thermal characteristics symbol r jc r cs characteristic (per package unless otherwise noted) junction to case case to sink (use high efficiency thermal joint compound and planar heat sink surface.) min typ max 0.12 0.08 unit c/w volts caution: these devices are sensitive to electrostatic discharge. proper handling procedures should be followed. apt website - http://www.advancedpower.com ARF1510 d1 s1d2 g1 g2 s2 d3 g3 s3d4 g4 s4
050-4926 rev a 12-2004 dynamic characteristics ARF1510 symbol c iss c oss c rss t d(on) t r t d(off) t f characteristic input capacitance output capacitance reverse transfer capacitance turn-on delay time rise time turn-off delay time fall time test conditions v gs = 0v v ds = 200v f = 1 mhz v gs = 15v v dd = 500v i d = 9a @ 25c r g = 1.6 ? min typ max 1200 1800 100 130 20 26 8 5 18 10 unit pf ns functional characteristics symbol g ps test conditions f = 40.7 mhz v gs = 0v v dd = 400v p out = 750w no degradation in output power characteristic common source amplifier power gain drain efficiency electrical ruggedness vswr 6:1 min typ max 13 15 75 unit db % 1 pulse test: pulse width < 380 s, duty cycle < 2%. apt reserves the right to change, without notice, the specifications and information contained herein. thermal considerations and package mounting: the rated 1500w power dissipation is only available when the package mounting surface is at 25c and the junction temperature is 200c. the thermal resistance between junctions and case mounting surface is 0.12c/w. when installed, and additional thermal impedance of 0.08c/w between the package base and the mounting surface is typical. insure that the mounting surface is smooth and flat. thermal joint compound must be used to reduce the effects of small surface irregularities. the heat sink should incorporate a copper heat spreader to obtain best results. the package is designed to be clamped to a heatsink. a clamped joint maintains the required mounting pressure while allowing for thermal expansion of both the device and the heat sink. a simple clamp and two 6-32 (m3.5) screw can provide the minimum 125lb required mounting force. t = 12 in-lb. hazardous material warning the ceramic portion of the device between leads and mounting surface is beryllium oxide, beo. beryllium oxide dust is toxic when inhaled. care must be taken during handling and mounting to avoid damage to this area. these devices must never be thrown away with general industri- al or domestic waste. d1 s1d2 g1 g2 s2 d3 g3 s3d4 g4 s4 arf 1510 clamp heat sink ARF1510 1.065" 27.05 mm 1.065" 27.05 mm .100 .100 .300 .300 .100 .175 .075 .100 .100 .175 .075 d1 s1d2 g1 g2 s2 d3 g3 s3d4 g4 s4 .005 .045 .254


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